Etching is usually called etching, bite etching, concave etching, etc. Etching is to use typical gas combination to form the gas equivalent ionization body with strong etching property and produce other gases such as CO,CO2,H2O and so on to achieve the purpose of etching.

Most of the gases used for etching are fluorine containing gases, and carbon tetrafluoride is the most used. Tetrafluorocarbon is a colorless and odorless gas, non-toxic and non-flammable. However, it has anesthetic effect in high concentration. Therefore, the container stored in industrial application is a special high-pressure gas cylinder, and the pressure reducing valve used is also a special pressure reducing valve.

Tetrafluorocarbons are ionized by the plasma cleaning machine to produce etched gas equiionization containing hydrofluoric acid components, which can achieve etching and organic removal on various organic surfaces, and are widely used in wafer manufacturing, circuit board manufacturing, solar panel manufacturing and other industries.