Today, fluorine-etched gases are an invisible "knife" that is widely used in semiconductor or LCD front-end processes, and can even carve nanoscale grooves into micron-thick films.

So, what are the fluorine-containing etching gases? How do they work?

The gas used in etching is called etching gas, usually fluoride gas, such as carbon tetrafluoride, perfluorobutadiene, nitrogen trifluoride, hexafluoroethane, perfluoropropane, trifluoromethane, etc.

As an important branch of electronic gas, fluorine-containing etching gas is an indispensable raw material for the production of ultra-large scale integrated circuits, planar display devices, solar cells, optical fibers and other electronic industries. It is widely used in semiconductor processes such as thin film, etching, doping, vapor deposition and diffusion.

There are wet chemical etching and dry chemical etching.

Dry etching is widely used because of its strong directionality, precise process control, convenience, no degum, no substrate damage and contamination.

Etching is to etch the processing surface without photoresist covering on the substrate, such as silicon oxide film, metal film, etc., so that there are photoresist masking areas preserved, so as to get the required imaging pattern on the substrate surface. The basic requirements of etching are: neat edges, clear lines, small transformation difference, and no damage or erosion to the surface of photoresist film and its masking protection.